Abstract: In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) ...
Abstract: In this work, a hybrid 3-D spectral-element spectral-integral (SESI) method is developed by combining the spectral element method (SEM) and spectral integral method (SIM) for the fast ...
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