Abstract: A novel antenna-in-package (AiP) of a 2-D array is proposed for sub-terahertz (Sub-THz) applications at the 250–310-GHz band. The 2-D array is decomposed into several 1-D row subarrays ...
Watch as we present the top trends from the show and learn the pressing issues like the GLP-1 boom, patient-centric design, and sustainability.
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion of datacentre infrastructure. Co-Packaged Optics (CPO) offer an alternative ...
Abstract: The design of memory semiconductors involves satisfying various customer demands and rapid provision of high-quality products; therefore, manufacturers have developed high-quality memory ...
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