A new transceiver invented by electrical engineers at the University of California, Irvine boosts radio frequencies into ...

And while the technology sounds impressive now, it seems to be at the limits of what current laboratory photolithography can provide. At present, a 1 mm fibre chip can potentially integrate tens of ...

The country just broke ground on its first integrated chip plant, part of its ambition of pushing itself up the global ...

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...

TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers ...

A joint China–US research team has developed a self-etching fabrication method that allows intricate patterning of 2D perovskite materials for the first time.

The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...

Sumitomo Bakelite Co. (Tokyo) announced plans to acquire all shares of a company newly established by Kyocera Corp., and ...

The helium market is poised for growth fueled by semiconductor manufacturing expansion, MRI fleet growth in mid-income nations, and commercial space launchesDublin, Jan. 22, 2026 (GLOBE NEWSWIRE) -- ...

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

TSMC's faces costs, politics, and capacity obstacles. Once framed as politically motivated, TSMC's US expansion has evolved into a costly long-term commitment exceeding US$165 bil ...

As consumer electronics and smart devices become more common, display technology plays an increasingly important role in electronic devices. Chinese ...