powerelectronicsnews

PCIM 2026: onsemi’s Antoine Jalabert on the GaNEXUS Launch and the Push into GaN

At PCIM 2026, onsemi’s Antoine Jalabert discusses the GaNEXUS launch and the company’s broader push into lateral GaN. AJ: Very intense—we just announced the GaNEXUS, and we got a lot of requests, a ...
powerelectronicsnews

PCIM 2026: Infineon’s Peter Wawer on Grid Resilience, Solid-State Circuit Breakers, and the Path to 800V Data Centers

Infineon’s Peter Wawer discusses solid-state circuit breakers, CoolSiC JFETs, grid resilience, and the shift to 800V DC. In this PCIM Europe 2026 interview, Power Electronics News Editor-in-Chief ...
powerelectronicsnews

onsemi Launches GaNEXUS GaN Power Portfolio

The new GaN devices support compact power architectures with lower losses, improved thermal performance and easier integration. onsemi has launched GaNEXUS™, a new gallium nitride (GaN) power ...
powerelectronicsnews

TSMC Paves the Way to One-Trillion-Transistor Devices

#TSMC’s 2026 Europe Technology Symposium laid out a path to one trillion transistors per package by 2030 — combining A12, CoWoS scaling to 48x, SoIC, and co-packaged optics into a single AI platform. ...
powerelectronicsnews

Navitas Launches Isolated TO-247 Package for HV SiC MOSFETs

The new package integrates high-voltage isolation and direct cooling to improve efficiency, reliability and power density. Navitas Semiconductor has introduced the UHV TO-247-4 ISO package, a new ...
powerelectronicsnews

Power Electronics Course with QSPICE (Episode 12): Other Components for Circuit Protection

Episode 12 of the QSPICE course covers TVS diodes and MOV varistors for power circuit overvoltage protection. After examining the operation of fuses in the previous installment of this course, we now ...
powerelectronicsnews

Power Module from SiC Discrete Devices Repackaged: Part 2

Part 2 examines IMS-based repackaging of discrete SiC devices as a cost-effective alternative to commercial power modules. High-performance silicon carbide (SiC) semiconductor-based power modules ...
powerelectronicsnews

JEDEC Publishes New SiC Evaluation and Reliability Guidelines

The new JEDEC guidelines establish common methodologies for SiC reliability assessment and short-circuit evaluation. JEDEC Solid State Technology Association has released two new guideline documents ...
powerelectronicsnews

Why 800 VDC Power Distribution is Gaining Traction in AI Data Centers

800 VDC promises 157% more power through the same copper cross-section, but standards, connectors, and SSTs must catch up. For hyperscale data centers operating high-density racks, the traditional ...
powerelectronicsnews

onsemi Launches Elite Pairing Studio for SiC Power Devices

Elite Pairing Studio evaluates silicon carbide (SiC) MOSFET and gate driver combinations early in the design cycle. onsemi has released the Elite Pairing Studio, a cloud-based design tool that ...
powerelectronicsnews

800 VDC Power Architecture in AI Data Centers, TSMC Europe Technology Symposium, SiC-Based Power Modules: Power Electronics Week Insights

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on 800 VDC Power Architecture in AI Data Centers, TSMC Europe Technology Symposium, and SiC-Based Power ...
powerelectronicsnews

Power Module

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on AlN Power Transistors, SiC Power Module Innovations, and Longevity of EV Batteries!