Wide-bandgap (WBG) power semiconductor devices based on silicon carbide (SiC) and gallium nitride (GaN) enable improved power conversion efficiencies. The improved power density that they provide ...
AI workloads consuming 1.5 kW per chip—with projections reaching 4-5 kW—are forcing a fundamental shift in data center power architectures. The challenge is no longer just capacity, but delivery.
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