The chip foundry, better known as TSMC, said its sales in February increased 22.2% in local currency from the same month last year to the equivalent of $10 billion. However, TSMC's sales dropped 20.8% ...

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, today announced at Embedded World in ...

Klepsydra Technologies, a leader in high-performance edge computing software, and BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, ...

The agreement with NSIG subsidiaries Simgui and Simwings extends the existing licensing framework underpinning their longstanding partnership, with no new technology transfer and a joint commitment to ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced the pricing of a secondary public offering of 20,000,000 ordinary shares to the public at a price to the public of $42.00 per share and $300 million ...

As a compliment, Silicon Germanium (SiGe) remains a critical enabler of high‑performance optical transceivers – powering the analog and mixed‑signal electronics that drive and receive optical signals.

SEMIFIVE announced that it has signed a turnkey design contract worth KRW 18,000 million (approximately USD 12.5 million) with an AI semiconductor fabless company. This contract marks a follow-on ...

SANTA ROSA, Calif. -- Keysight Technologies, Inc. (NYSE: KEYS) today introduced new 224G test solutions that expand its 1.6T end-to-end portfolio, addressing the growing R&D validation and ...

IBM and Lam Research have a five-year agreement focused on developing new materials, fabrication processes, and High-NA EUV lithography to advance IBM’s logic scaling roadmap, the companies said in a ...

Mick Posner highlights Cadence’s chiplet platform to support physical AI development. What is included in Cadence’s Physical AI Chiplet Platform? What is the Chiplet Spec-to-Packaged Parts ecosystem?

NUREMBERG, Germany — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that its Ceva-NeuPro-Nano neural processing unit NPU IP has won the ...

More and more powerful AI chips are needed for increasingly complex AI applications. Aiming to boost Germany’s innovative strength in this cutting-edge technology in Heilbronn, the Fraunhofer ...