Abstract: Carbon nanotube (CNT) is recently proposed as an alternative material for through-silicon via (TSV) to meet the requirements for high-density scaling and 3-D stacking. In this article, by ...
XDA Developers on MSN
Here are all the new features Microsoft added to Excel in January 2026
Excel gets a host of new features in January 2026 ...
The first step is to go over all works in the OpenAlex snapshot and extract the relevant information. After parsing the primary topic of each work, a row is appended to the corresponding file in ...
Abstract: The thermal–mechanical and signal reliability of through-silicon via (TSV) occupies an important position in three-dimensional integrated circuits (3D-ICs). However, few studies combined the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results