EPC claims its seventh-generation, 40-V power transistor delivers up to 3X better performance than equivalent silicon MOSFETs ...
Why security is important to the chiplet supply chain. Synopsys' 3DIC Compiler platform, enhanced by AI optimizations, handles multi-die and advanced chiplet packaging co-design and optimization for 2 ...
Andy’s back from the 2026 Analog Aficionados meetup, held at DesignCon this year, and pieces together some history of the event as well as launching a downloadable annual ...
Check out the breaking news, videos, and podcasts at this year's Embedded World conference. Mick Posner highlights Cadence’s chiplet platform to support physical AI development. Multiphase Power ...
Three of Electronic Design’s most colorful editors will be attending North America’s leading power conference and would love ...
The independent technology information source for electronics engineers, programmers and developers.
The independent technology information source for electronics engineers, programmers and developers.
The independent technology information source for electronics engineers, programmers and developers.
How VisualSim Architect models complex multi-die and chiplet-based systems before implementation. Why UCIe latency analysis is important when integrating chiplets from different vendors. How comparing ...
In celebration of International Women's Day, I did a special drawing to capture the event.
Using LnFP technology as an active material, OMI said it has developed a rapid ion transport cathode designed to handle ...
Tensor integrates more than 400 Arm-based cores per vehicle, underpinning its AI-first approach to Level 4 autonomy.
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