SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint Research co-founder Neil ...

Yangtze Memory Technologies Co. Ltd (YMTC), China’s twin memory star alongside ChangXin Memory Technologies (CXMT), is following CXMT’s IPO path to capitalize on the memory chip crunch in the AI era ...

Technical discussions of EV on-board chargers usually focus on the high-power conversion stage: SiC versus GaN, bidirectional topologies, power density, and high-voltage battery architectures. Those ...

The political shockwaves from the Nexperia episode are still reverberating across Europe’s semiconductor debate. What began as a company-specific controversy has evolved into a broader strategic ...

1. Logical versus arithmetic views of a digital function. Having said this, it is generally preferable to employ a single consistent format to cover both cases, and it is easier to view logical ...