As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients ...

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...

Vietnam has scored another victory in its bid to move beyond back-end assembly and packaging and establish an IC design and testing presence. Mixel, an analog and mixed-signal IP developer, is opening ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...