EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
AZOM

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
EDN

Novellus debuts CMP tool for 65-nm and below ICs

SAN JOSE, Calif. — Novellus Systems Inc. moved to lower the cost of chemical mechanical planarization (CMP) Monday (June 21) by rolling out a 300-mm tool that it claimed could be used down to the ...
Yahoo Finance

Innovations in Thin Wafer Handling Solutions Set to Drive 5.52% CAGR in Semiconductor Industry by 2032

Dublin, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Carrier for Thin Wafer Market - Global Forecast 2025-2032" has been added to ResearchAndMarkets.com's offering. Senior ...
Business Insider

Global Metrology, Inspection, and Process Control in VLSI Manufacturing Markets 2020: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology

Dublin, Oct. 16, 2020 (GLOBE NEWSWIRE) -- The "Metrology, Inspection, and Process Control in VLSI Manufacturing" report from The Information Network has been added to ResearchAndMarkets.com's offering ...
Semiconductor Engineering

Temporary Bonding: Enabling the Next Generation of Ultrathin Wafers

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for ...