RESEARCH TRIANGLE PARK, N.C. — Flip-chip technology supplier Unitive Inc. here today announced qualification of its eutectic wafer-bumping process for volume production of high-density ...
Get ready for wafer-level packaging. The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) said at Semicon West in San Francisco this week that it will install a complete 300mm line ...
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...
PLAINVIEW, N.Y., Feb. 12, 2019 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer ...
MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the SEMICON ...
Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...
Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Onto Innovation Inc. (ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di ™ technology on the Dragonfly ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results