Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

A software library has been developed by Beckhoff Automation, Bosch Rexroth, and Siemens to support the PackAL standard. Designed for their respective A software library has been developed by Beckhoff ...

Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.