Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
Igor’s Lab has provided some updates on Arrow Lake-S and its associated LGA 1851 socket, including 3D schematics of the CPU loading mechanism (bracket) and the chipset itself. Igor also unveiled a ...
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