Multi-chip module (MCM) graphics cards just might be the future, bringing upcoming generations of GPUs to a whole new level. Combining multiple dies instead of relying on a single chip could provide ...
Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
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