Nasdaq

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
EDN

UMC certifies Cadence 3D-IC reference flow

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
EDN

Synopsys and TSMC Deliver 3D-IC Design Support

Supports multi-die integration using TSMC CoWoS™ technology Includes enhanced versions of Synopsys' Galaxy™ Implementation Platform tools Increases productivity, accelerates time to market and speeds ...
Business Wire

Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...
Seeking Alpha

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

PITTSBURGH, April 23, 2025 /PRNewswire/ -- Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and ...
Business Wire

Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit Designers can achieve system-driven PPA through the availability of integrated thermal, ...
Semiconductor Engineering

Reduce 3D-IC Design Complexity: Early Package Assembly Verification

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design ...
Semiconductor Engineering

Ten Reasons 3D-IC Will Profoundly Change The Way You Design Electronics

The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were ...
KXAN

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

PITTSBURGH, Oct. 26, 2022 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ ...
Seeking Alpha

UMC and Cadence join hands on 3D-IC hybrid bonding reference flow

United Microelectronics (NYSE:UMC) and Cadence Design Systems (NASDAQ:CDNS) collaborate on the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, certified for UMC’s chip stacking ...
Digi Times

UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow

United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies. Save my User ID and ...