Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates... Taiwan IC backend ...
LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
BANGALORE, India, Dec. 17, 2025 /PRNewswire/ --Semiconductor Advanced Substrate Market Size The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...
Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand... Unimicron ...
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