Gigavis is showing strong performance. It appears that the analysis predicting the establishment of a dominant position in glass substrates, such as flip-chip ball grid array (FC-BGA), is influencing ...
Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...
New FC-BGA Substrate unveiled in the CES 2023 1 st Significant production achieved in last year, Full-Scale Production will be possible in the 2 nd half of this this year CEO Jeong Cheol-dong ...
Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA) ...
March 14 (Reuters) - TOPPAN Holdings Inc: * TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END ...
To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...
LG Innotek recently unveiled the latest FC-BGA for the first time at the 'CES 2023'. LG Innotek's FC-BGA is highly integrated, multi layered and large scaled. Also, it has fine patterning and a lot of ...
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