Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies "The adoption of Edge AI applications ...

Synopsys IP and Certified EDA Design Reference Flow Speed Heterogeneous Integration on SF5/4/3 Nodes "Semiconductor designers are dealing with new levels of complexity as they develop high-performance ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not feasible to fit everything onto a single planar die. But determining when to ...

What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...

Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X New Synopsys certified AI-driven digital and analog ...