In modern CPU device operation, 80% to 90% of energy consumption and timing delays are caused by the movement of data between the CPU and off-chip memory. To alleviate this performance concern, ...
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
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Fujitsu flaunts massive 144-core Monaka Arm chip — 2nm and 5nm chiplets, 3D-stacked CPU cores over memory
Fujitsu has demonstrated a mechanical sample of its Armv9-based 144-core Monaka processor for data centers, revealing some details. Less than a week ago, it disclosed that it is being developed with ...
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