The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...
The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...
Integrative analysis of stress-responsive pathways in pearl millet under multiple abiotic challenges
Global crop yields are declining due to rising temperatures, water scarcity, and salinized soils. Wheat, rice, and maize suffer yield losses ranging from 50% to 80% under these stressors. With the ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
Scientists discover ultra-weak faults near the 7.2 magnitude earthquake in Haiti that continued to slip for weeks.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results